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One of the biggest challenges facing PCB designers is in not understanding the cost drivers in the PCB manufacturing process. We will wrap up this DFM series with a summary of cost drivers that impact delivery, quality, and reliability. It is categorized by low-, medium-, and high-cost adders.
Low-cost Adders (< 10% board cost)
Complex routing and scoring mean a small increase in process time, but a process is still required which will be driven by NC programming; it may limit tool life as a function of diameter. Thicker or thinner PWBs (>0.093", <0.030") means a material cost variation but it is minimal. Via plug or button print requires a small process change to the screen-print mask dot.
Medium-cost Adders (10–25%)
Regarding drilled hole quantity, there is a cost adder for high-density design-driven hole count and process time. With smaller drilled hole size, the small drill diameter (<0.010") limits throughput and stack height.
Embedded resistors with Ohmega/Gould technology will need additional core testing and finished board verification. Non-FR-4 materials, like PTFEs, can be 10 to 20 times the FR-4 cost, and material cost is generally 25–50% of the board cost. Edge plating will have additional processes required prior to plating.
To read this entire article, which appeared in the May 2023 issue of Design007 Magazine, click here.
Paul Carpine, Siemens Digital Industries Software
When do you first start thinking about the selling price of your new product? It’s impossible to avoid the question of what the price will be. The worst answer is: “I don’t know, let’s see after the first samples.” Let’s say the product’s selling price is $49; then the manufacturing cost will be $20. During each design change, the manufacturing cost should be recalculated to make sure the product is still competitive. This means you should involve people from both the development and cost calculation teams. This circle will be repeated until the final design is released, and the final calculation is done.
Kelly Dack, CID+
Filbert Arzola of Raytheon Intelligence & Space taught a Professional Development course at IPC APEX EXPO on general design practices. During a break, Filbert spoke with Kelly Dack about some of today’s design strategies and how designers are reacting to them. What matters most?
Andy Shaughnessy, Design007 Magazine
Paul Cooke, the senior director of business development for Ventec International Group, is presenting a class at IPC APEX EXPO 2023 that looks at workflow challenges in fabrication, and the myriad drivers that can affect yield, reliability, and cost. Here he discusses the details of this Professional Development course, what he hopes attendees will take away, and why designers and design engineers would benefit from this class.