Dana on Data: Filling the Gap When Tribal Knowledge Runs Out

The March issue of Design007 Magazine took on the topic of tribal knowledge. The magazine posed this question: Is tribal knowledge friend or foe? The articles generally discussed the value and concern of having a significant amount of knowledge locked into peoples’ heads. Articles also discussed how that knowledge can be transferred into automation for both repeatability, quality, and manufacturing cycle time reduction.

This year there has been a concerted effort to bring PCB fabrication, assembly, and semiconductor production from China to North America, India, Southeast Asia, and Europe as a way to reduce IP and economic security exposure. Multiple government initiatives, such as the U.S. CHIPS Act and proposed Printed Circuit Board and Substrates Act, are starting to address this.

This obviously makes sense due to the existing global political environment. As a byproduct of this transition, I am semi-regularly contacted with requests for support in building and defining new factories, improving quality in new factories, or providing names for individuals with these specific skills.

Unfortunately, the number of experts who hold onto this tribal knowledge is decreasing. This seems to be a significant issue for the proposed expansions. Where will this information come from? Is there another way to transfer this expertise without using this dwindling human tribal knowledge?

I’d like to focus on just the design-to-manufacturing data transfer component.

Currently most companies require that humans physically read their design requirements and then manually type them into their engineering/CAM systems. At first you may think that I’m crazy to make such a statement. No company has a specification that states, “The manufacturer shall manually read the design requirements prior to entering them into their systems.”

I am correct, though. Studies have shown that more than 80% of design data sets transfer partial design information as a PDF file (or Gerber layer) that requires a human to read and interpret this data. This is, in effect, a de facto requirement. An existing manufacturer is required to take an experienced operator, with tribal knowledge offline, to train a new employee on how to interpret the notes, discrepancies, tolerances, stackups, design intent, revision verification, etc. This training period typically takes up to one year to get to a basic understanding of what to watch for and how to intelligently propose potential solutions to the customer. To be considered an expert, it typically takes to up to five years for an experienced product engineer to receive and resolve the thousands of issues in data packages.

There are probably only a few hundred front-end engineering experts in North America and probably even fewer in the EU. So, where will the new facilities get that expertise? There aren’t a sufficient number of training classes or courses in available to teach new potential employees in colleges and universities.

How can we mitigate this crisis? The first step is for companies to quit sending manufacturing documentation that requires human intervention. This can be accomplished by using intelligent data formats, such as ODB++ (from Siemens) or IPC-2581 (from IPC).

These formats can eliminate the following, often conflicting documents.

Fabrication Drawing
The following fabrication drawing technical information can be embedded in an IPC-2581 file:

  1. Board outline dimensions and tolerances
  2. Stackup (Such as thicknesses, material/AVL, impedances, loss, and tolerances)
  3. Plating and surface finish specifications/locations (These can be assigned to specific nets, pads, etc.)
  4. General notes
  5. A drawing number and revision is not required since there won’t be a drawing
  6. The drill table (This can be extracted from the file)
  7. Cavity size, tolerances, and orientation
  8. Embedded component location
  9. Rigid-flex regions and flexible shapes and bend radiuses, etc.
  10. Assembly placement information

A drawing can be created from the data, if required. There are several excellent software packages currently being used.

Netlist
Netlists are not required to be sent. The netlist was created to verify that EIA-RS-274-D files were transferred correctly due to errors that were encountered due to merging the separate D-Code file. Intelligent files generally do not have netlist issues, except for intentional same net shorts, which is a defect in the IPC-356 file format but are not a real defect. (This was fixed in IPC-2581.) Incoming netlist comparison to the intelligent file graphical data is not required. Netlists that are required for electrical testing can be extracted from the IPC-2581 file.

Stackup Drawing/File
The stackup information and impedance specification is incorporated in the file, along with the tolerances. The proposed stackup information can then be included into an IPC-2581 file and sent back to the designer in the same file for direct comparison. No stackup structure, via structure information, or material is required to be sent as a picture on the fab print or in a separate Excel or PDF file.

Bill of Material (BOM) /Approved Vendor List (AVL)
A separate spreadsheet is not required to pass component BOM and AVL information. This is incorporated into the IPC-2581 file, then extracted from the file, and passed automatically to the CFX database.

There is a significant amount of information that can be incorporated into the intelligent file formats. In turn, this eliminates conflicting information between files. It reduces the number of experts required to train these new operators to interpret the design and manufacturing.

Teams that I have been involved with for over 20 years have implemented design transfer packages that could 100% be transferred without human intervention. Both ECAD and CAM software are commonly available. Our industry needs to adopt this methodology to reduce the future critical resource issue that these new facilities will face just for data transfer.

Dana Korf is the principal consultant at Korf Consultancy LLC. 

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2023

Dana on Data: Filling the Gap When Tribal Knowledge Runs Out

08-07-2023

The March issue of Design007 Magazine took on the topic of tribal knowledge. The magazine posed this question: Is tribal knowledge friend or foe? The articles generally discussed the value and concern of having a significant amount of knowledge locked into peoples’ heads. Articles also discussed how that knowledge can be transferred into automation for both repeatability, quality, and manufacturing cycle time reduction.

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Dana on Data: Can ChatGPT Solve My PCB Data Transfer Quality Problem?

05-18-2023

The media is talking about how artificial intelligence will replace all of us with its ability to search massive amounts of online data to create fast, automatic solutions. To this end, I asked ChatGPT how to solve the data transfer quality problem. Below are three questions I posed, along with ChatGPT’s unedited responses, followed by impressions about how well the AI did.

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Dana on Data: Are You Ready for 3D AME?

04-04-2023

The PCB interconnect revolution has started. We are no longer constrained to X/Y trace routing with large drilled vias & pads connecting individual horizontal routing layers. Why be constrained with a trapezoidal trace? Why not route with twisted pairs or a coax interconnect? Additively manufactured electronics (AME) eliminates the need for through, blind, and buried vias by replacing them with a trace at non-vertical angles. What’s holding this implementation up?

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Dana on Data: An IPC APEX EXPO 2023 Data Transfer Mission

01-19-2023

January: Time to leave home and travel to sunny San Diego to attend the meetings, professional trainings, technical sessions, and exhibition at IPC APEX EXPO 2023. I hear that this year promises an excellent turnout for both the large exhibit floor and IPC committee meetings; maybe Tom Cruise will give us a fly-over from the Miramar Top Gun airbase? For myself, I have a full agenda and new tennis shoes, so my feet won’t wear out as soon as they did last year.

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2022

Dana on Data: PCB Data Transfer Non-evolution

12-08-2022

The PCB industry still sends scanned copies of paper documents, which I have termed “ePaper,” back and forth to each other; this process requires humans to interpret the information on the electronic copy of a document before manually entering it into a computer. As many as 90% or more of all design data packages sent to manufacturing are still Gerber file-based with additional ePaper files. So much for the concept of continuous improvement.

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Dana on Data: My Holiday Season Data Wishlist

10-06-2022

Every year children often start creating their holiday gift list before Halloween. So, I thought that it would be a great idea to provide my holiday present request list to the PCB industry this month. My fundamental wish is simple: I wish to make it easier for designers to output designs and for PCB fabricator front-engineering teams to spend less time reviewing data so they may release production tooling into their factories faster. Secondarily, these requests should reduce the NPI cycle time and cost by reducing the insidious back and forth DFM review Technical Query (TQ) cycle. Here is my gift wish list.

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Dana on Data: Time for a Data Format Revolution

07-28-2022

Starting in the 1950s, the Gerber data format, complemented with several paper and electronic files, was used to transfer the physical PCB data from designers to fabricators and assemblers. RS-274-D and RS-274X gave us incremental improvements to the Gerber format, but still required several additional files to transfer all the data. IPC-D-356 was released in 1992 to provide a data transfer quality check. The 274X format with associated file, are still the most predominant data transfer package in use today, 70+ years later. Hard to believe from the highest technology industry on the planet.

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Dana on Data: DFM Issue Reduction—Company-specific PCB Acceptance Specifications

05-26-2022

PCB data packages commonly generate fabricator DFM feedback questions that require resolution. Resolving these issues delays the manufacturing cycle time until the issues are resolved. There are many methods and techniques to reduce the DFM issues, such as working with the fabricator to review proposed stackup materials and impedance structures early in the design cycle. Another common method is to generate a company specific acceptance specification that provides requirements that are not covered in referenced IPC specifications and include negotiated DFM issue resolutions.

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Dana on Data: Is the Customer Always Right?

03-03-2022

Is the customer always right when it comes to customer PCB design data? Fabricators would be taking the design data and building the supplied data verbatim if this was true. The fabricator would only need to compensate conductors to account for etching processes and map finished hole sizes to drill sizes.

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2021

Dana on Data: Understanding Mechanical Drill Size Capability and Cost

09-29-2021

Fabricator capabilities are generally initially provided on a one-page summary as part of the general marketing presentation. The technical values that are presented provide the “check mark” information so the potential customer can determine if the fabricators capability is greater than the design requirements. Often, this is the only method used for design rule knowledge transfer.

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Dana on Data: The Critical Importance of the Fab Product Engineer

07-29-2021

Billions of dollars are spent yearly on CAD and CAM software to produce complex PCB designs and fabricate PCBs. The final technical manufacturing decisions generally are made by one person for each design. This is the PCB fabricator product engineer. But I don’t think most design, procurement, or NPI teams understand how critical this person is to the data transfer success and liability protection.

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Dana on Data: Effective Front-end Engineering External KPIs

05-13-2021

PCB fabricator front-end engineering departments are always under great pressure to be kept small, generate production tooling instantaneously from customer data and never, ever, make a mistake. Key performance indicators (KPI’s) emphasis internal process improvements and are generally simple in nature, such as jobs/person/day and scrap dollars/month.

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Dana on Data: Factory 4.0 NPI Compatible Industry Specification Format

03-11-2021

IPC APEX EXPO’s emphasis on the Connected Factory Initiative based on CFX and IPC-2581 is underway in a virtual mode this month. One area that has not been addressed is the automation of industry technical specifications from organizations like IPC, ASTM, UL, IEC, etc.

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Dana on Data: Factory 4.0 NPI Data Transfer Improvements

01-14-2021

The recently released IPC Connected Factory Initiative scope is similar to other Factory 4.0 models with the same glaring omission: They all seems to assume that the incoming design data can’t be used as-is and must be reviewed and potentially manually modified prior to manufacturing release.

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2020

Dana on Data: Reducing PCB Specification Interpretation Issues

11-12-2020

The PCB industry has accepted a low-quality level of provided documentation from its customers for the past several decades. In this column, Dana Korf reviews one common fabrication print note and asks, “How do you interpret this note?”

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Dana on Data: A Team Method to Reduce Fabricator Engineering Questions

09-03-2020

Hundreds of PCB designs are released to be quoted or fabricated every day around the world, and most will have engineering questions or technical queries generated once the data package has been received and analyzed. Dana Korf outlines seven fundamental steps based on Lean/Six Sigma concepts to reduce data transfer issues.

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Dana on Data: How Can the PCB Industry Improve From COVID-19 Responses?

07-16-2020

In response to the COVID-19 pandemic, the world transformed a very slow medical approval process into the equivalent of a concurrent NPI process by challenging some of the golden rules. Dana Korf shares his thoughts on four areas the PCB industry can re-evaluate and improve.

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Dana on Data: The Importance of PCB Technology Roadmaps

05-14-2020

Peter Drucker once said, “Trying to predict the future is like trying to drive down a country road at night with no lights while looking out the back window.” Dana Korf explains how it is critical that PCB fabricator technology roadmaps and capacity planning align with their customers’ product development and volume requirements to ensure that optimum cost, reliability, and performance goals are achieved.

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Dana on Data: Automating DFX Transfer and Analysis Using IPC-2581C

03-19-2020

We are inching closer to a world where a complete intelligent PCB data transfer is realized. The IPC 2-16 Digital Product Model Exchange (DPMX) Subcommittee has just sent revision C out for IPC-2581 Consortium review with final industry approval targeted for this June. Dana Korf discusses the significant additions and their impact.

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Dana on Data: Creating IP-protected PCB Design Rules

01-09-2020

One of the primary reasons that data packages aren’t compatible is the fabricator/assembler does not provide a complete set of design rules out of concern of giving away their intellectual property (IP). Dana Korf explores the design rule development hierarchy as well as what should be included in an IP-protected design rule document.

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2019

Dana on Data: The DFM/Data Transfer Process Is Broken

11-14-2019

In a world that is showing great strides toward implementing a Factory 4.0 world, why can’t a design be passed from a designer to the fabricator without errors every time? Dana Korf emphasizes moving the responsibility up in the food chain, examines key design package error categories, and proposes creating a cultural change.

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New Column—Dana on Data: IPC-2581 Intelligent Bi-directional Data Flow

09-12-2019

The IPC Consortium is nearing completion of transferring notes on drawings and working with IPC on converting key IPC specifications into attributes that can be automatically loaded into CAD and CAM systems. This format is extendable to created automated company-specific acceptance files that can be automatically loaded into the CEM’s or fabricator’s engineering systems. IPC-2581 data format is being widely used globally and now needs to become the standard to reduce NPI cycle times by associating critical design information automatically to the physical features.

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