Beyond Design: Integrating AI Into PCB Design Flow

Editor's note: Charles Pfeil contributed to this column.

Today’s PCB design tools are a far cry from the rudimentary tools we used 30 years ago, but even though the algorithms are now quite clever, they are still fairly basic as far as intelligence goes. Comprehensive design rules can be established to accommodate myriad constraints to limit placement and routing which advise us when we have overstepped the boundaries. But what if artificial intelligence (AI) was introduced into the mix? How could it enhance the PCB design environment? What would happen if we applied AI/machine learning techniques as part of the design flow?

Pfeil 1.JPGPCB designers are used to complex designs and much of the design process is a fairly straightforward engineering challenge. However, the number of options and potential interactions has soared. There are many ways to achieve the same goal, but some ways are better than others in the context of system integrity or a specific application. Still, keeping track of all the possible tradeoffs and options in a complex design is approaching technological singularity—the hypothetical point when computer capacity rivals that of a human brain.

Google, Xilinx, Synopsys, Intel, Cadence, and Siemens are all working on AI applications for silicon design. Recently, machine learning (ML)-based techniques have been efficiently utilized in several applications, where enhanced learning capability makes them unique to solve any complex/nonlinear problem. IC design has also benefited from ML techniques at different design levels, from device modeling to test of manufactured chips. IC layout is a very labor-intensive task that typically requires iteration. The performance of an IC depends on where things sit relative to each other. The distances between objects, the wire length, capacitance, and the inductance of the interconnects are also important. After the initial layout, the simulated values of variables are back-annotated to the design. This first layout may not be perfect, so further iterations are required. Reducing the number of iterations and, hence, the design cycle time by using AI, can be extremely cost-effective.

Much of the same methodology happens with PCB layout: We do a pre-layout simulation to determine the constraints, a post-layout simulation to verify the layout, and then the results are back-annotated. This process can also take many iterations.

Earlier this year, Cadence announced the release of the Allegro X AI cloud technology. Cadence states that it dramatically reduces design turnaround time (10X) by automating placement, power plane generation, and critical net routing. Cadence has been developing place and route (P&R) tools for IC synthesis for decades and has now adapted the technology for PCB P&R. Shorter interconnects and reduced crossovers are essential for both chip and PCB layout but critical routing incorporating signal integrity and flight time requirements is of greater importance for the PCB.

Unfortunately, most EDA vendors do not have the same resources to pour into R&D as the Big Tech companies. Such financial backing, coupled with creative engineering, reduces time-to-market. So, EDA tools will inevitably take much longer to develop. Then, most EDA companies are primarily interested in doing R&D that increases sales in the next cycle, not long term.

Currently, EDA tools use algorithms to control auto-placement and routing. This is a set of instructions that a computer program follows to accomplish a task. PCB routers have gone through many different stages of development over the years, from third-party applications that were difficult to learn, use, and interface, to a cohesive, cloud-based, layout/router environment. IC and PCB routing applications have used many of the same algorithms over time, including:

  • Lee's Algorithm (maze routing)
  • Dijkstra's Algorithm (shortest path)
  • Grid-based routing
  • Rip-up and reroute
  • Shape-based, push-and-shove
  • Steiner Tree (rectilinear routing)
  • Heuristic (topology) routing

It is not so much the algorithms that differ, but rather the environment that dictates which algorithm is most effective.

Olney_Aug23_Fig1_cap.jpg

With the advent of AI, machine learning applies artificial intelligence that provides systems with the ability to automatically learn and improve from experience without being explicitly programmed. This is sort of like how proficient PCB designers know how to best tackle a complex task: Experience is the best teacher of all. These algorithms are procedures that are implemented in code and run-on data. Machine learning models are output by algorithms and are comprised of model data and a prediction algorithm. Machine learning algorithms provide a type of automatic programming where machine learning models represent the program. In other words, algorithms are the building blocks that make up machine learning and artificial intelligence.

A machine learning model (Figure 1) is a model that has been trained to recognize certain types of patterns. A model is trained over a set of data, providing it with an algorithm that it can use to reason over and learn from those data. Specifically, machine learning models are computer programs that are used to recognize patterns in data or to make predictions. Machine learning models are created from machine learning algorithms. These algorithms adapt, evolve, and improve themselves based on the data they process. The models can be used to make predictions, categorize information, or discover patterns.

How Could AI Improve Placement and Routing of a PCB?
Skilled PCB designers have many years of experience laying out complex designs such as high-speed FPGA and memory circuits, so AI needs to absorb this same information in order to achieve the same (or better) results but in a much shorter timeframe. Data in the form of design rules and images of preferred routing strategies can be fed into the input layer of the machine learning model. Algorithms in the hidden layers of the model can then process this data, and recognize, predict, and create the resultant layout (Figure 2).

Olney_Aug23_Fig2_cap.jpg

Sample images of steadfast routing patterns plus the netlist, appropriate rules for electrical and mechanical constraints, frequently used stackup configurations, system timing, and memory timing requirements (plus sample eye diagrams of working designs) are fed into the model where the learning algorithms recognize and process the images and data to predict an optimal solution.

Machine learning uses two types of techniques: supervised learning, which trains a model on known input and output data so that it can predict future outputs, and unsupervised learning, which finds hidden patterns or intrinsic structures in input data.

Choosing the right algorithm can seem overwhelming; there are dozens of supervised and unsupervised machine learning algorithms, and each takes a different approach to learning. There is no best method or one size fits all. Finding the right algorithm is partly just trial and error but is also based on the recognition of patterns learned, and experience with similar designs. The algorithm selection also depends on the technology used (e.g., DDR4), frequency, and rise time of the signal.

The biggest issue in training AI with PCB images is the availability of data. ChatGPT had access to the unlimited wealth of information available on the internet, however, PCB models only have access to the images and data fed into the machine learning model which, by comparison, is extremely limited. One way around this would be to create an open-source global repository for PCB layout images and databases that have endorsed functionality. However, convincing customers to share their designs may be difficult as most do not wish to publicly expose their intellectual property.

Key Points

  • There are many ways to achieve the same goal, but some ways are better than others in the context of system integrity or a specific application.
  • Reducing the number of iterations and, hence, the design cycle time by using AI can be extremely cost-effective.
  • Shorter interconnects and reduced crossovers are essential for both chip and PCB layout but critical routing incorporating signal integrity and flight time requirements is of greater importance for the PCB.
  • Currently, EDA tools use algorithms to control auto-placement and routing.
  • With the advent of AI, machine learning applies artificial intelligence that provides systems the ability to automatically learn and improve from experience without being explicitly programmed.
  • Algorithms are the building blocks that make up machine learning and artificial intelligence.
  • A machine learning model is a model that has been trained to recognize certain types of patterns.
  • AI needs to absorb and learn from information in order to achieve the same (or better) results.
  • Finding the right algorithm is partly just trial and error but is also based on the recognition of patterns learned and experience with similar designs.

Resources

  • Beyond Design: Artificial Intelligence in EDA Tools by Barry Olney
  • “What is artificial intelligence,” ibm.com
  • “What is Artificial Intelligence,” by Alyssa Schroer, May 19, 2023, builtin.com
  • “EDA Vendors Widen Use of AI,” by Ed Sperling, Sept. 29, 2021, semiengineering.com

Charles Pfeil worked in the PCB industry for more than 50 years as a designer and owner of a service bureau. Now retired, he is the original product architect for Expedition PCB and an inventor of XtremePCB and more recently enhanced the Altium routing technology.

This column originally appeared in the August 2023 issue of Design007 Magazine.

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2023

Beyond Design: Integrating AI Into PCB Design Flow

08-24-2023

Today’s PCB design tools are a far cry from the rudimentary tools we used 30 years ago, but even though the algorithms are now quite clever, they are still fairly basic as far as intelligence goes. Comprehensive design rules can be established to accommodate myriad constraints to limit placement and routing which advise us when we have overstepped the boundaries. But what if artificial intelligence (AI) was introduced into the mix? How could it enhance the PCB design environment? What would happen if we applied AI/machine learning techniques as part of the design flow?

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Beyond Design: Standing Waves in Multilayer PCB Plane Cavities

07-20-2023

Plane cavities in multilayer PCBs are essentially unterminated radial transmission lines.  They form a transmission line that propagates electromagnetic (EM) energy within a plane cavity emanating from a feed point, within the plane, and outward in all directions. Like all transmission lines, it will reflect if not terminated. This creates standing waves—ringing. The bigger the mismatch, the bigger the standing waves, and the more the impedance will be location-dependent. As frequency and edge rates continue to increase, the impact of intrinsic electrical characteristics becomes more pronounced. AC switching currents in the power/ground planes can be very large. Under these circumstances, a plane pair acts more like a radial transmission line rather than a distributed planar capacitor.

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Beyond Design: Balancing Trade-offs for Optimal PCB Design

06-21-2023

The field of PCB design is evolving rapidly, which creates both opportunities and demands for new and experienced designers. PCB designers must deal with various issues in finding the right balance between the form factor, functionality, and power requirements of their boards while ensuring that the stackup, placement, and routing are completed to guarantee stringent signal and power quality. Advanced tools and skills are needed to create compact, flexible, high-performance and low-power PCBs with faster turnaround times.

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Beyond Design: Select Dielectric Material With Precision

05-11-2023

In the past, selecting a dielectric material for PCB fabrication was a no-brainer because we all just used FR-4. Clock frequencies were low and signal rise times were slow, so substrate performance was not an issue. However, in today's multi-gigabit designs, with their extremely fast rise times and tight timing margins, precise material selection is crucial to the performance of the product. This puts the materials selection process under tighter scrutiny. Materials used for the fabrication of multilayer PCBs absorb high frequencies and reduce edge rates, which is a major cause of signal integrity issues. But not all of us are designing cutting-edge boards. Sometimes we tend to overspecify requirements, which can lead to inflated production costs.

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Beyond Design: Containing Electromagnetic Fields in Wireless PCB Design

04-20-2023

The path of electromagnetic energy in multilayer PCBs is generally guided by a signal trace bounded by the plane(s). However, as the demand for high-density, high-performance microwave (µWave), and millimeter wave (mmWave) circuits increases in the latest wireless technologies, the electromagnetic fields require more stringent control as they tend to radiate more—particularly on microstrip (surface) layers. Thus, as we enter the realm of µWave (3-30 GHz) and mmWave (30-300 GHz) designers are compelled to implement waveguide techniques, used traditionally in RF design, to reduce radiation loss.

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Beyond Design: The Interaction of Electromagnetic Fields

03-30-2023

When two (or more) electromagnetic fields overlap or meet, they add vectorially at each point in space. Fields have direction and polarity. At any point in space, there can be only one field, so at some spacial points, they will cancel each other, and at others, they will re-enforce each other. James Clerk Maxwell described electromagnetic fields as being linear. Linearity implies superposition, meaning that the fields do not merge with each other but rather add vectorially—distorting the signal. This applies to both static (DC) and time-varying (AC) fields.

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Beyond Design: Displacement Current—The Key to Electromagnetic Energy Propagation

02-23-2023

The propagation of electromagnetic energy can be controlled in a number of ways depending on the medium the energy is traveling in. However, electromagnetic waves do not require a medium to propagate. This means that electromagnetic waves can travel not only through liquids, solids, and air, but also through the vacuum of space. What’s more, they do not require electron current flow for the transfer of energy.

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Beyond Design: The Eye Diagram

02-02-2023

An eye diagram is a useful tool for the analysis of signals used in digital transmission. It provides a quick scan of system performance and can offer insight into the nature of channel imperfections. An eye diagram is simply a graphical display of a serial data signal with respect to time that shows a pattern that resembles an eye. Careful scrutiny of this visual display can give one a first-order approximation of signal-to-noise, clock timing jitter, reflections and skew. In this month’s column, I will take an eyeball look at the eye diagram.

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2022

Beyond Design: Forget What You Were Taught

12-01-2022

Ralph Morrison was a physicist who promoted the belief that electromagnetic energy flows in spaces, not the traces. That energy does not flow in the copper traces of a PCB, but rather the energy follows the traces acting as a waveguide and propagates through the dielectric material. This explains many electromagnetic (EM) effects such as radiation from outer microstrip layers and from stripline fringing fields, how components can be magnetically coupled, and why crosstalk is created by overlapping EM fields. But it also raises a few questions.

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Beyond Design: Routing Strategies to Minimize Radiation

10-19-2022

Electromagnetic (EM) energy propagates through the dielectric materials of a multilayer PCB guided by the signal traces between the planes, for inner stripline layers, but it acts slightly differently on the outer microstrip layers. Microstrip layers generally have a solid ground reference plane on one side but allow radiation from the boundless surface into the air. A well-thought-out routing strategy can avoid up to 10 dB of radiation from the substrate. Embedding signals between the planes reduces these emissions, and susceptibility to radiation, as well as providing electrostatic discharge protection. So, not only can one prevent noise from being radiated but also reduce the possibility of being affected by an external source.

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Beyond Design: Utilizing a Field Solver for Stackup Planning

09-22-2022

In a previous column, I deliberated on why the 2D field solver is an essential tool for all high-speed PCB designers. But like all tools, one needs to know how best to apply its unique features to enhance your design process. Obviously, calculating transmission line impedance, in its various forms, is the prime function but field solvers can also provide additional information to ensure good design practice way before the layout begins.

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Beyond Design: PCB Design Strategies to Reduce Costs

08-23-2022

There are numerous ways to improve the PCB design and production processes and thereby reduce costs, from fundamental improvements involving a standard form factor and reducing the board size and complexity to technology choices and simulation to reduce iterations. A good starting point would be the IPC standards which were developed by the electronics industry to enhance manufacturability, testability, and assembly. Anyone new to PCB development should initially begin with these standards and then fine-tune them to capture the essence of their design style.

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Beyond Design: 2D Field Solver–An Essential Tool for High-speed PCB Design

07-25-2022

A field solver is the engine behind signal and power integrity analysis. You never see it but it performs all the magic of simulation. In its elementary form, the field solver can employ Maxwell’s equations to calculate the parasitic elements of a solution space. This method is referred to as 2D extraction and is used to analyze and synthesize a stackup to achieve a target single-ended or differential impedance. The velocity of propagation can also be extracted to perform signal integrity analysis. A field solver can be used as a stand-alone tool or as part of a simulation environment. In this month’s column, I will take a look at 2D field solvers.

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Beyond Design: Copper Pours in High-speed Design

06-14-2022

The most common question I get asked by PCB designers is, "Do you need copper ground pours on digital multilayer PCBs?" The short answer is, "It depends." Unfortunately, the myth of copper pours is fueled by reference designs that seem to persistently use this old RF design technique. Copper pours are sometimes used incorrectly simply to fill in the unused space on a board. However, in some cases ground pours may be an advantage. In this month’s column, I will look at where and where not to use ground pours.

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Beyond Design: Reflecting on Reflections

05-31-2022

When a transmission line is perfectly matched to the driver and load, the signals propagating electromagnetic (EM) energy are totally absorbed by the load. This is the perfect scenario that all electronics designers strive for. However, this is rarely the case and reflections do occur whenever the impedance of the transmission line changes along its length. This can be caused by unmatched drivers/loads, layer transitions, different dielectric materials, stubs, vias, connectors and IC packages. By understanding the causes of these reflections and eliminating the source of the mismatch, a design can be engineered to perform reliably.

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Beyond Design: Designing for the SAP Fabrication Process

04-21-2022

PCB designers are continually challenged with demands for reduced product size. However, form factor-driven design pressures have been relieved, in part, by the increased use of high-density interconnects (HDIs), which enable more functionality per unit area than conventional PCBs. Leveraging finer lines, thinner materials, and laser-drilled vias, HDIs have played a crucial role in device miniaturization. However, the traditional PCB subtractive etch processing becomes very difficult for feature sizes below 3 mil trace/space. This forces PCB designs to become more complex as electronics packages shrink—adding extra routing layers, and microvia layers, and increasing the number of lamination cycles required, all of which impact yield, reliability, and thus cost.

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Beyond Design: The Coupling Coup

03-09-2022

Coupling on a multilayer PCB may be a good or bad thing. On one hand, close coupling of signal traces to reference planes and differential pair signals is the best way to prevent common mode radiation and to mitigate electromagnetic (EM) emission. But on the other hand, close coupling of unrelated signal traces can bring us grief with unintentional crosstalk caused by overlapping EM fields. In this month’s column, I will look at where close coupling should be used and where it should be avoided.

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Beyond Design: PCB Design Challenges—Change is Good

03-08-2022

In 2022, PCB designers are faced with two big challenges: demands for increased performance and a condensed product footprint. So, what’s new? Columnist Barry Olney recalls back some 50-odd years ago the challenges for the electronics professional were much the same. "I had just become comfortable with valves and next we had diodes, transistors, and LEDs." This column chronicles these and other changes.

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2021

Beyond Design: The Impact of Filled Vias on Thermal and Signal Integrity

11-24-2021

The growing popularity of wide bandgap (WBG) semiconductors, such as gallium nitride (GaN) and silicon carbide (SiC) has enabled components to achieve higher operating temperatures and power outputs than silicon-based technology. However, this has not eliminated the need for careful thermal management to evenly distribute the heat generated to avoid the formation of dangerous hot spots and to minimize power losses. The heat generated by integrated circuits poses great challenges, especially given today’s higher speeds, smaller board surface areas, and multiple devices populated on PCBs.

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Beyond Design: The Impact of No-Clean Flux Residue on Signal Integrity

10-28-2021

Most electronic products today are assembled using the no-clean soldering process. The need for no-clean solder pastes emerged in response to legislation against the use of ozone-depleting chemicals, and the appeal of removing the costly flux cleaning operations in the assembly of PCBs.

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Beyond Design: PDN Trends and Challenges

09-23-2021

Power Distribution Network (PDN) planning is a relatively new technology that has become an essential, interrelated component of signal integrity analysis. However, mainstream PCB developers have yet to adopt PDN analysis as a common design process.

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Beyond Design: Fly-over Technology—When It All Gets Too Fast

08-26-2021

The role of fly-over cables is to isolate signals from the limitations of the PCB materials. As signal speeds increase, the dielectric material’s Df and Dk become an issue, and traces need to be shaped and routed perfectly, without skew, to avoid signal coupling, crosstalk, and electromagnetic compliance (EMC) issues.

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Beyond Design: Switchbacks in Tuned Routing

07-20-2021

A switchback is a 180° bend in a road, rail or path, especially one leading up the side of a mountain. Switchback also refers to a long trombone bend in a tuned serpentine trace. But, rather than increase the delay, of the signal, the switchback actually speeds it up due to the near (NEXT) and far-end (FEXT) crosstalk effects. In this month’s column, Barry Olney looks at why long, parallel switchbacks should be avoided.

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Beyond Design: High-Speed Serial Link PCB Design

06-10-2021

Serial communication has been used long before computers ever existed. The telegraph system using Morse code is one of the first digital modes of communication. All you need is two connections, which makes it simple and relatively robust. Columnist Barry Olney explains how this relates to PCB design.

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Beyond Design: Dampening Plane Resonance with Termination

03-25-2021

Today’s high-speed multilayer PCBs have multiple planes. The ground planes are used for shielding and to provide return current continuity. Whereas, closely coupled power/ground plane pairs provide low inductance power to the ICs and reduce the AC impedance and plane resonance of the Power Distribution Network (PDN).

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Beyond Design: Stackup Configurations to Mitigate Crosstalk

02-16-2021

Crosstalk is three dimensional and is dependent on the signal trace separation, the trace to plane(s) separation, parallel segment length, the transmission line load, and the technology employed. But, crosstalk also varies depending on the physical stackup configuration. In this month’s column, Barry Olney delves into the properties of microstrip and stripline crosstalk and how to mitigate the concern.

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Beyond Design: Stackup Planning—Three Decades of Innovation

02-01-2021

Stackup planning involves careful selection of materials and transmission line parameters to avoid impedance discontinuities, signal coupling, unintentional return paths, high AC impedance and excessive electromagnetic emissions. Materials used for the fabrication of multilayer PCBs, absorb high frequencies and reduce edge rates thus putting the materials selection process under tighter scrutiny. Ensuring that your board’s stackup and impedances are correctly configured is a good basis for stable product performance.

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2020

Beyond Design: Simulation Slashes Iterations

12-18-2020

The majority of high-speed digital designs take at least two iterations to develop into a working product. However, multilayer boards can be designed to work right the first time with little additional effort. Barry Olney explains how design re-spins will continue to happen until designers make regular use of simulation software.

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Beyond Design: Routing Strategies for High-Speed PCB Design

11-12-2020

As the typical PCB design becomes more complex, so do the techniques and strategies required—not only to complete the design but also to create a functioning product that performs to specification. Barry Olney describes why PCB designers need to understand the underlying high-speed issues of the design based on simulation and then translate these into corresponding design constraints.

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Beyond Design: Fringing Fields

10-23-2020

Electromagnetic energy is all around us. Barry Olney looks at how electromagnetic radiation can be emitted from the edges of planes in multilayer PCBs by the fringing fields possibly causing EMC issues.

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Beyond Design: Stackup Planning, Part 6—Impedance Variables

09-15-2020

Interconnect impedance is a trade-off between the variables, including trace width, trace (copper) thickness, dielectric thickness, and dielectric constant. Barry Olney continues with Part 6 of his stackup impedance planning series and looks at the correct process, as well as the consequences of bad decisions.

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Beyond Design: The Wavelength of Electromagnetic Energy

08-24-2020

The speed of light is the one universal physical constant that we are yet to break. Barry Olney looks at how to simply measure the speed of light and how the wavelength of electromagnetic energy relates to the multilayer PCB.

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Beyond Design: Alternative Series Termination Techniques

08-03-2020

The three most common termination strategies are series, end, and differential. In this column, Barry Olney elaborates on two particular cases of series termination that every PCB designer will come across.

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Beyond Design: Split Planes–Reprise

07-15-2020

A high-speed digital signal crossing a split in the reference plane impacts at least three aspects of design integrity: signal quality, crosstalk, and EMI. Barry Olney reviews the two common solutions, plus introduce a third optimal solution for high-speed design.

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Beyond Design: The Impact of Signal Rise Time on Bandwidth

06-15-2020

The term bandwidth was first used years ago in the RF world to represent the range of frequencies in a signal. In digital electronics, we also use the term to describe the signal spectrum since square waves are made up of numerous sine waves (harmonics) of the fundamental frequency. Barry Olney looks at the relationship between signal rise time and the bandwidth of a digital signal.

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Beyond Design: Predicting and Measuring Impedance

06-05-2020

To control the impedance of high-speed signal interconnects, one first needs to predict the impedance of a specific multilayer stackup configuration. Barry Olney describes how a precision field solver is arguably the most accurate way to calculate the single-ended, edge-coupled, and broadside-coupled differential impedance.

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Beyond Design: Transmission Line Termination

04-23-2020

Whenever a signal meets an impedance variation along a transmission line, there will be a reflection, which can seriously impact signal integrity. By understanding the causes of these reflections and eliminating the source of the mismatch, a design can be engineered with reliable performance. Barry Olney looks at how to effectively terminate transmission lines.

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2019

Beyond Design: My 100th Column

10-16-2019

Believe it or not, this is my 100th “Beyond Design” column. To wrap it up, I look back over the past 99 columns and reflect on what I believe to be the most enlightening for high-speed PCB designers, counting down in reverse order of preference.

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Beyond Design: The Curse of the Golden Board

09-25-2019

Electric fields and magnetic fields play an equal role in moving energy in a multilayer PCB. EM fields also move energy in free space, but not at DC. The presence of voltage implies that there is an electric field, and the changing of that electric field creates a magnetic field. What may not be appreciated is that moving a voltage between two components requires moving energy (not a signal), which requires the existence of both electric and magnetic fields.

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Beyond Design: Stackup Planning, Part 5

08-14-2019

In my previous column series on stackup planning, I described the traditional stackup structures that use a combination of signal and power/ground planes. But to achieve the next level in stackup design, one needs to not only consider the placement of signal and plane layers in the stackup, but also visualize the electromagnetic fields that propagate the signals through the substrate.

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Beyond Design: The Key to Product Reliability

07-22-2019

With today’s rapid product development cycles and time-to-market pressures, PCB designers are pushed to their limit. This situation leaves many developers with the question of how to ensure that their high-speed digital design performs to expectations, is stable given all possible diverse environments, and is reliable over the products projected life cycle. As developers avoid the expense and delays of re-engineering the product, they look to employ design integrity methodologies during the design phase.

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Beyond Design: High-speed PCB Design Constraints

06-10-2019

Digital design has entered a new realm. Modern high-speed design (HSD) not only requires the designer to continuously break new ground on a technical level but also requires the designer to account for significantly more variables associated with higher frequencies, faster transition times, and higher bandwidths. Ignoring signal and power integrity and electromagnetic compatibility invites schedule delays and increases development costs and the possibility of never succeeding to build a functional product, which is a career-limiting strategy.

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Beyond Design: Fast and Accurate Transmission Line Modeling

05-22-2019

The ability to simulate complex PCB design has become a critical factor in the success of a project. Today’s high-speed processors and SERDES interfaces coupled with sometimes unrealistic time-to-market requirements are pushing design teams toward more nimble development processes. However, there is no point in completing a design on time if it does not work!

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Beyond Design: The Proximity Effect

04-29-2019

Skin effect and the proximity effect are manifestations of the same principle—magnetic lines of flux cannot penetrate a good conductor. The difference between them is that skin effect is a reaction to the magnetic fields generated by current flowing within a conductor, while proximity effect is generated by current flowing in other nearby traces or planes. The frequency at which both effects begin to occur is the same. In this month’s column, I will focus on the proximity effect.

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Beyond Design: Not All PCB Substrates Are Created Equal

03-25-2019

PCB substrates are all around us in every gadget we use. The substrate may be rigid or flexible, or a combination of both. It is a carrier for the electronic devices and the signal and power interconnects and is usually planar in structure with conductors separated by insulating dielectric materials. However, each product has a specific performance requirement and may need a distinct type of substrate to comply with the product’s specifications.

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10 Fundamental Rules of High-Speed PCB Design, Part 5

02-14-2019

The final part of the 10 fundamental rules of high-speed PCB design focuses on board-level simulation encompassing signal integrity, crosstalk, and electromagnetic compliancy. Typically, a high-speed digital design takes three iterations to develop a working product. However, today, the product life cycle is very short, and therefore, time to market is of the essence. The cost per iteration should not only include engineering time but also consider the cost of delaying the products market launch.

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Beyond Design: 10 Fundamental Rules of High-speed PCB Design, Part 4

01-02-2019

Part 4 of the 10 fundamental rules of high-speed PCB design deals with the routing of critical signals and return path discontinuities. Needless to say, matched delay and length, differential pairs, and other critical signals should be routed first with the precision they require before less important low-speed and static signals are completed. Maintaining this priority is imperative.

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